No.6360-20
T:100um PO:90um Adhesive:10um High adhesion forchip flying
NO.636020 Dicingtape (for Wafer)
roduct Introduction
Dicing tapes (for wafer) consist of higher isotropic olefin backingand UV peeling adhesive.
Applications and Features
For all kinds of wafer dicing
Dicing tape(for Wafer)
High fixation power
Structure
Thickness (mm):0.100
General Property
| Test Item | Unit | Value | ||
| Adhesion | N/10mm | 3.20 | ||
| Tack | Ball No. | - | ||
| Holding power | Creepmm/24h | <0.1 | ||
| Adhesion | ToUV | N/10mm | 0.22 | |
*Test Method: In accordance with slion
