No.6360-95 T:170um PO:150um Adhesive:20um For high bumpysurface
日本狮力昂（Slion）UV晶片切割系列胶带：
#6360-00，#6360-20，#6360-80，#6360-15，#6360-50,#6360-25
产品特点：以具有強等方性伸特性的聚烯烴作為底基，切割時可堅固地固定物體
用途：UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶，能使用於硅晶等，各種晶片的切割
NO.636095 Dicingtape (for Circuit Boards)
Product Introduction
Dicing tapes (for circuit board) consit of higher isotropic olefinbacking and UV peeling adhesive.
Applications and Features
For all kinds of substrate dicing
Dicing tape(for Circuit Boards)
Easy pick up
Strong adhesion
Structure
Thickness (mm):0.170
General Property
| Test Item | Unit | Value | ||
| Adhesion | N/10mm | 4.10 | ||
| Tack | Ball No. | - | ||
| Holding power | Creepmm/24h | <0.1 | ||
| Adhesion | ToUV | N/10mm | 0.10 | |
*Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N
