日本狮力昂（Slion）UV晶片切割系列胶带：
#6360-00，#6360-20，#6360-80，#6360-15，#6360-50,#6360-25
产品特点：以具有強等方性伸特性的聚烯烴作為底基，切割時可堅固地固定物體
用途：UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶，能使用於硅晶等，各種晶片的切割
Product Introduction
Dicing tapes (for wafer) consist of higher isotropic olefin backingand UV peeling adhesive.
Applications and Features
For all kinds of wafer dicing
Dicing tape(for Wafer)
Structure
Thickness (mm):0.100
General Property
| Test Item | Unit | Value | ||
| Adhesion | N/10mm | 2.80 | ||
| Tack | Ball No. | 6 | ||
| Holding power | Creepmm/24h | 0.1 | ||
| Adhesion | ToUV | N/10mm | 0.23 | |
Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N
